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Thread: Hydro-Massage Equipment Bonding
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01-25-2009, 06:20 AM #1
Hydro-Massage Equipment Bonding
Does anyone have a good graphic or photo of proper hydro-massage equipment grounding to share?
Thanks,
Aaron
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01-25-2009, 07:19 AM #2
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01-25-2009, 07:37 AM #3
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01-25-2009, 09:29 AM #4
Re: Hydro-Massage Equipment Bonding
I recently found a situation where the contractor ran a #8 copper bonding wire all the way back to the panel in this situation. It was run right along the 12/2 that was feeding the tub.
Nice mis-interpretation of the code in this example.
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01-25-2009, 10:02 AM #5
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01-25-2009, 01:47 PM #6
Re: Hydro-Massage Equipment Bonding
(underlining is mine)
I think you meant bonding?
From the 2008 NEC. (underlining and bold are mine)
- 680.74 Bonding.
- - All metal piping systems and all grounded metal parts in contact with the circulating water shall be bonded together using a solid copper bonding jumper, insulated, covered, or bare, not smaller than 8 AWG. The bonding jumper shall be connected to the terminal on the circulating pump motor that is intended for this purpose. The bonding jumper shall not be required to be connected to a double insulated circulating pump motor. The 8 AWG or larger solid copper bonding jumper shall be required for equipotential bonding in the area of the hydromassage bathtub and shall not be required to be extended or attached to any remote panelboard, service equipment, or any electrode.
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01-25-2009, 01:58 PM #7
Re: Hydro-Massage Equipment Bonding
I am sure he did.
Notice I was very subtle in my reply and referred to it as bonding?
Did not want to sound like a jerk correcting him.
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01-25-2009, 02:11 PM #8
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01-25-2009, 02:12 PM #9
Re: Hydro-Massage Equipment Bonding
You would not sound like a jerk correcting him, we all correct each other all the time, we have to, otherwise, people reading the posts and the replies can get the idea that something is what it is not, and that something is allowed which is not allowed.
It is for the good of all that each of us is as correct as possible, and that when we are incorrect, we are corrected - happens to all of us all the time ... *which, at least on this board, is a GOOD THING*, some boards may frown on it.
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07-10-2009, 01:58 AM #10
Re: Hydro-Massage Equipment Bonding
The bonding lug shall be tested by UL
Comply with UL Standard for Safety for Wire Connectors,UL486A-486B.
right?
thanks~
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07-10-2009, 01:04 PM #11
Re: Hydro-Massage Equipment Bonding
LY:
680.74 Bonding.
All metal piping systems and all grounded metal parts in contact with the circulating water shall be bonded together using a solid copper bonding jumper, insulated, covered, or bare, not smaller than 8 AWG. The bonding jumper shall be connected to the terminal on the circulating pump motor that is intended for this purpose. The bonding jumper shall not be required to be connected to a double insulated circulating pump motor. The 8 AWG or larger solid copper bonding jumper shall be required for equipotential bonding in the area of the hydromassage bathtub and shall not be required to be extended or attached to any remote panelboard, service equipment, or any electrode.
The bonding requirement for hydromassage bathtubs requires interconnection between metal piping systems and metal parts associated with the water recirculation system only at the hydromassage bathtub location. As is the case with swimming pool bonding, this section does not require the installation of a bonding conductor from the hydromassage bathtub pump motor to the service equipment or panelboard from which the hydromassage bathtub branch circuit originates even if there is no metal piping or metal parts in the vicinity of the hydromassage bathtub.
The bonding required by 680.74 is intended to create a local equipotential plane, and the equipment grounding conductor of the branch circuit supplying the hydromassage tub provides the path for ground fault current. As is the case with other bonding requirements in Article 680, the 8 AWG copper bonding conductor is required to be a solid conductor. Solid conductors are required for Article 680 equipotential bonding applications in order to provide an added level of resistance to physical damage.
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